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Preliminary Technical Data
FEATURES
Tri-axis gyroscope +320 degrees/second measurement range 14-bit resolution Tri-axis accelerometer +10g measurement range 14-bit resolution 350Hz Bandwidth Factory calibrated sensitivity and bias Digitally controlled sensitivity and bias Digitally controlled sample rate Digitally controlled filtering Programmable condition monitoring, alarms Auxiliary digital I/O Digitally activated self-test Programmable power management Embedded Temperature Sensor SPI(R)-compatible serial interface Auxiliary 12-bit ADC input and DAC output Single-supply operation: +4.75V to +5.25 V 2000 g powered shock survivability
Tri Axis Gyroscope & Accelerometer ADIS16350
GENERAL DESCRIPTION
The ADIS16350 iSensorTM provides complete tri axis inertial sensing (both angular and linear motion) in a compact module fully ready for system integration. With Analog Devices' iMEMSTM sensor technology at its core, the ADIS16350 includes embedded processing for sensor calibration and tuning. An SPI interface allows for simple system interface and programming. The SPI port provides access to the following embedded sensors: X, Y, and Z axis angular rate; X, Y, and Z axis linear acceleration; Internal Temperature; Power Supply; and an Auxiliary analog input. The inertial sensors are precision aligned across axis', and are calibrated for offset and sensitivity. System interfacing is simplified with the following additional programmable features: In-system Bias Auto Calibration Digital Filtering and Sample Rate Self Test Power Management Condition Monitoring Auxiliary Digital I/O
APPLICATIONS
Guidance and control Platform control and stabilization Motion control and analysis Inertial Measurement Units General Navigation Image stabilization Robotics
The ultra compact module measures 22.7mmx23.2mmx22.9mm, plus mounting extensions.
FUNCTIONAL BLOCK DIAGRAM
Rev. PrA
11/10/2006 10:59 AM One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 (c)2006 Analog Devices, Inc. All rights reserved.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
ADIS16350
Preliminary Technical Data
REVISION HISTORY
9/06--Revision PSD1: Initial Version
Rev. PrA | Page 2 of 10
Preliminary Technical Data SPECIFICATIONS
TA = -40oC to +85C, VCC = 5.0 V, Angular Rate = 0/s, Dynamic Range 320/sec, +1g, unless otherwise noted. Table 1.
Parameter GYRO SENSITIVITY Dynamic Range Initial Conditions Each axis Full-scale range over specifications range 25C, Dynamic range = +320/sec 25C, Dynamic range = +160/sec 25C, Dynamic range = +80/sec -20C to 75C 25C, difference from 90 degrees ideal 25C, relative to base-plate & guide pins Best fit straight line 25C, 1 25C, 1 25C -20C to 75C Any Axis VCC = 4.75 V to 5.25 V At 25C, +320 o/s Dynamic range, no filtering At 25C, +160 o/s Dynamic range, minimum 4 tap filter setting At 25C, +80 o/s Dynamic range, minimum 16 tap filter setting At 25C, f= 25Hz, no average Min 320 0.07233 Typ Max
ADIS16350
Unit /s /s/LSB o /s/LSB o /s/LSB ppm/oC degree degree % of FS
o o o o
Sensitivity Drift over Temp Axis Non-orthogonality Axis Misalignment Non-Linearity GYRO BIAS In Run Bias Stability Turn on - Turn on Bias Stability Angular Random Walk Zero Rate Bias Drift over Temp g Sensitivity Voltage Sensitivity GYRO NOISE PERFORMANCE Output Noise
0.07326 0.03663 0.01832 +500 TBD TBD +0.1 0.016 0.035 3.6 +0.06 0.2 1.0 TBD TBD TBD 0.05 350 14 TBD
0.07400
/s /s o /hr o /s/C o /s/g o /s /V
o
/s rms /s rms /s rms /s/Hz rms
o
o
Rate Noise Density GYRO FREQUENCY RESPONSE Sensor Bandwidth Sensor Resonant Frequency Turn-on Time GYRO SELF-TEST STATE Change for positive stimulus Change for negative stimulus ACCELEROMETER SENSITIVITY Dynamic Range Initial Sensitivity Drift Over Temperature Axis Non-orthogonality Axis Misalignment Nonlinearity ACCELEROMETER BIAS 0g Offset 0g Offset Over Temperature Axis Non-orthogonality Axis Misalignment
o
Power on from Sleep Mode to +2o/s of final, no averaging, min sample period Relative to nominal output Relative to nominal output Each axis @25C 25C, difference from 90 degrees ideal 25C, relative to base-plate & guide pins Best Fit Straight Line @25C 25C, difference from 90 degrees ideal 25C, relative to base-plate & guide pins TBD 439 -439 10 TBD
Hz kHz ms
721 -721
1092 -1092
LSB LSB g mg/LSB ppm/C degree degree % of FS mg mg/C degree degree
2.78 TBD TBD TBD 0.2
TBD
TBD TBD TBD TBD
Rev. PrA | Page 3 of 10
ADIS16350
Table 2. (Continued)
Parameter ACCELEROMETER NOISE PERFORMANCE Output Noise Noise Density ACCELEROMETER FREQUENCY RESPONSE Sensor Bandwidth Sensor Resonant Frequency ACCELEROMETER SELF-TEST STATE Output Change When Active TEMPERATURE SENSOR Output at 25C Scale Factor ADC INPUT Resolution Integral Nonlinearity Differential Nonlinearity Offset Error Gain Error Input Range Input Capacitance DAC OUTPUT Resolution Relative Accuracy Differential Nonlinearity Offset Error Gain Error Output Range Output Impedance Output Settling Time LOGIC INPUTS Input High Voltage, VINH Input Low Voltage, VINL Conditions @25C, no filtering @25C, no filtering Min
Preliminary Technical Data
Typ TBD 0.072 Max Unit LSB rms LSB/Hz rms
350 10 @25C 44 80 1278 -2.13 12 2 1 4 2 0 During acquisition 5 k/100 pF to GND For Code 101 to Code 4095 20 12 4 1 5 0.5 0 to 2.5 2 10 2.0 0.8 For -CS signal when used to wake up from SLEEP mode VIH = 3.3 V VIL = 0 V 0.55 0.2 -40 10 2.4 0.4 0.5 20,000 20 128 10 -60 2.5 120
Hz kHz LSB LSB LSB/C Bits LSB LSB LSB LSB V pF Bits LSB LSB mV % V s V V V A A pF V V Sec Cycles Years
Logic 1 Input Current, IINH Logic 0 Input Current, IINL Input Capacitance, CIN DIGITAL OUTPUTS Output High Voltage, VOH Output Low Voltage, VOL SLEEP TIMER Timeout Period1 FLASH MEMORY Endurance2 Data Retention3
ISOURCE = 1.6 mA ISINK = 1.6 mA
TJ = 55C
Rev. PrA | Page 4 of 10
Preliminary Technical Data
Table 3. (Continued)
CONVERSION RATE Minimum Conversion Time Maximum Conversion Time Maximum Throughput Rate Minimum Throughput Rate POWER SUPPLY Operating Voltage Range VCC Power Supply Current 0.9766 1.937 1024 0.516 4.75 Normal mode at 25C Fast mode at 25C Sleep mode at 25C 5.0 48 77 500 5.25
ADIS16350
ms Sec SPS SPS V mA mA A
1 2
Guaranteed by design Endurance is qualified as per JEDEC Standard 22 Method A117 and measured at -40C, +25C, +85C, and +125C. 3 Retention lifetime equivalent at junction temperature (TJ) 55C as per JEDEC Standard 22 Method A117. Retention lifetime decreases with junction temperature.
Rev. PrA | Page 5 of 10
ADIS16350
TIMING SPECIFICATIONS
TA = +25C, VCC = +5.0 V, angular rate = 0/sec, unless otherwise noted. Table 4.
Parameter fSCLK tDATARATE tCS tDAV tDSU tDHD tDF tDR tSFS
1 2
Preliminary Technical Data
Description Fast mode, SMPL_TIME 0x07 (fS 256 Hz) Normal mode, SMPL_TIME 0x08 (fS 228 Hz) Chip select period, fast mode, SMPL_TIME 0x07 (fS 256 Hz) Chip select period, normal mode, SMPL_TIME 0x08 (fS 228 Hz) Chip select to clock edge Data output valid after SCLK falling edge2 Data input setup time before SCLK rising edge Data input hold time after SCLK rising edge Data output fall time Data output rise time CS high after SCLK edge3
Min1 0.01 0.01 40 100 48.8 24.4 48.8
Typ
Max 2.5 1.0
100
5 5 5
12.5 12.5
Unit MHz MHz s s ns ns ns ns ns ns ns
Guaranteed by design, not production tested. The MSB presents an exception to this parameter. The MSB clocks out on the falling edge of CS. The rest of the DOUT bits are clocked after the falling edge of SCLK and are governed by this specification. 3 This parameter may need to be expanded to allow for proper capture of the LSB. After CS goes high, the DOUT line goes into a high impedance state.
TIMING DIAGRAMS
tDATARATE tSTALL
CS
tSTALL = tDATARATE - 16/fSCLK
Figure 1. SPI Chip Select Timing
CS
tCS
1 SCLK 2 3 4 5 6 15 16
06108-002
SCLK
tSFS
tDAV
DOUT MSB DB14 DB13 DB12 DB11 DB10 DB2 DB1 LSB
tDSU
DIN W/R A5
tDHD
A4 A3 A2 D2 D1 LSB
06108-003
Figure 2. SPI Timing, Utilizing SPI Settings Typically Identified as Phase = 1, Polarity = 1
Rev. PrA | Page 6 of 10
Preliminary Technical Data ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Acceleration (Any Axis, Unpowered) Acceleration (Any Axis, Powered) VDD to COM Digital Input/Output Voltage to COM Analog Inputs to COM Operating Temperature Range Storage Temperature Range
1
ADIS16350
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 6. Package Characteristics
Package Type TBD JA TBD JC TBD Device Weight TBD
Rating 2000 g 2000 g -0.3 V to +7.0 V -0.3 V to +5.5 V -0.3 V to VCC + 0.3 V -40C to +105C -65C to +150C1
Extended exposure to temperatures outside of the specified temperature range of -40C to +85C can adversely affect the accuracy of the factory calibration. For best accuracy, store the parts within the specified operating range of -40C to +85C.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. PrA | Page 7 of 10
ADIS16350 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1 3 5 7 9 11 13 15 17 19 21 23 o o o o o o o o o o o o o o o o o o o o o o o o 2 4 6 8 10 12 14 16 18 20 22 24
Figure 3. Pin Configuration, Bottom, Pin View
Preliminary Technical Data
Table 7. Pin Function Descriptions
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
1
Mnemonic DNC DNC SCLK DOUT DIN ~CS DIO0 ~RST DIO1 VCC VCC VCC GND GND GND DNC DNC DNC DNC AUX_DAC AUX_ADC Y_ACCL X_ACCL Z_ACCL
Type1
I O I I I/O I I/O S S S S S S N/A N/A N/A N/A O I O O O
Description Do not connect Do not connect SPI, Serial clock SPI, Data output SPI, Data input SPI, Chip Select Digital I/O Reset Digital I/O Power supply Power supply Power supply Power ground Power ground Power ground Do not connect Do not connect Do not connect Do not connect Auxiliary, 12-bit digital-to-analog converter output Auxiliary, 12-bit, analog-to-digital converter in put Y-Axis acceleration X-Axis acceleration Z-Axis acceleration
S = supply, O = output, I = input.
Rev. PrA | Page 8 of 10
Preliminary Technical Data OUTLINE DIMENSIONS
ADIS16350
Figure 4. Dimensions shown in millimeters
ORDERING GUIDE
Model ADIS16350AML ADIS16350/PCBZ Temperature Range -40C to +85C Package Description Package Option
Rev. PrA | Page 9 of 10
ADIS16350
Preliminary Technical Data
NOTES
Rev. PrA | Page 10 of 10
PR06522-0-11/06(PrA)

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